Acceptor Doped Barium Titanate Based Thin Film Capacitors on Metal Foils and Methods of Making Thereof

ABSTRACT

The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing additives selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; wherein the barium/titanium-containing additives are not intentionally modified or doped; 
 
wherein the composition has been annealed in an environment having an oxygen partial pressure of less than about 10 −7  atmospheres and/or at a temperature in the range of 700° C. and 1050° C.; 
wherein a capacitor comprising the composition would have a loss tangent of greater than about 0.07; and wherein the composition is not reoxygenated.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.11/157,894 filed 21 Jun. 2005, and still pending, and therefore claims,pursuant to 35 U.S.C. 120, the benefit of priority from the parentapplication. Further, U.S. application Ser. No. 11/157,894 is herebyincorporated herein by reference.

TECHNICAL FIELD

The present invention pertains to thin film capacitors, moreparticularly to thin film capacitors formed on copper foil that can beembedded in printed wiring boards (PWB) to provide capacitance fordecoupling and controlling voltage for integrated circuit die that aremounted on the printed wiring board package.

RELATED ART

As semiconductor devices including integrated circuits (IC) operate athigher frequencies, higher data rates and lower voltages, noise in thepower and ground (return) lines and supplying sufficient current toaccommodate faster circuit switching becomes an increasingly importantproblem requiring low impedance in the power distribution system. Inorder to provide low noise, stable power to the IC, impedance inconventional circuits is reduced by the use of additional surface mountTechnology (SMT) capacitors interconnected in parallel. The higheroperating frequencies (higher IC switching speeds) mean that voltageresponse times to the IC must be faster. Lower operating voltagesrequire that allowable voltage variations (ripple) and noise becomesmaller. For example, as a microprocessor IC switches and begins anoperation, it calls for power to support the switching circuits. If theresponse time of the voltage supply is too slow, the microprocessor willexperience a voltage drop or power droop that will exceed the allowableripple voltage and noise margin and the IC will trigger false gates.Additionally, as the IC powers up, a slow response time will result inpower overshoot. Power droop and overshoot must be controlled withinallowable limits by the use of capacitors that are close enough to theIC that they provide or absorb power within the appropriate responsetime. This power droop and overshoot are maintained within the allowablelimits by the use of capacitors providing or absorbing power in theappropriate response time.

Capacitors for decoupling and dampening power droop or overshoot aregenerally placed as close to the IC as possible to improve theirperformance. Conventional designs have capacitors surface mounted on theprinted wiring board (PWB) clustered around the IC. In this case, largenumbers of capacitors requires complex electrical routing which leads toinductance. As frequencies increase and operating voltages continue todrop, power increases and higher capacitance has to be supplied atincreasingly lower inductance levels. A solution would be to incorporatea high capacitance density, thin film ceramic capacitor in the PWBpackage onto which the IC is mounted. A single layer ceramic capacitordirectly under the IC reduces the inductance to as minimum as possibleand the high capacitance density provides the capacitance to satisfy theIC requirements. Such a capacitor in the PWB can provide capacitance ata significantly quicker response time and lower inductance.

Embedding ceramic capacitor films in printed wiring boards is known.Capacitors are initially formed on metal foils by depositing a capacitordielectric material on the foil and annealing it at an elevatedtemperature. A top electrode is formed on the dielectric to form a firedcapacitor on foil structure. The foil is then bonded to an organiclaminate structure to create an inner layer panel wherein the capacitoris embedded in the panel. These inner layer panels are then stacked andconnected by interconnection circuitry, the stack of panels forming amulti-layer printed wiring board.

A high capacitance density capacitor can be achieved by use of adielectric with a high permittivity or dielectric constant (K) and athin dielectric. High dielectric constants are well known inferroelectric ceramics. Ferroelectric materials with high dielectricconstants include perovskites of the general formula ABO₃ in which the Asite and B site can be occupied by one or more different metals. Forexample, high K is realized in crystalline barium titanate (BT), leadzirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), leadmagnesium niobate (PMN) and barium strontium titanate (BST) and thesematerials are commonly used in surface mount component devices. Bariumtitanate based compositions are particularly useful as they have highdielectric constants and they are lead free.

Thin film capacitor dielectrics with a thickness of less than 1 micronare well known. Thin films can be deposited on to a substrate bysputtering, laser ablation, chemical vapor deposition, and chemicalsolution deposition. Initial deposition is either amorphous orcrystalline depending upon deposition conditions. Amorphous compositionshave low K (approximately 20) and have to be annealed at hightemperatures to induce crystallization and produce the desired high Kphase. The high K phase in barium titanate based dielectrics can only beachieved when grain sizes exceed 0.1 micron and so annealingtemperatures as high as 900° C. may be used.

Chemical solution deposition (CSD) techniques are commonly used to formthin film capacitors on metal foils. CSD techniques are desirable due totheir simplicity and low cost. High temperature annealing of bariumtitanate thin CSD films formed on base metal foils such as copper ornickel, require low oxygen partial pressures to avoid oxidation of themetal. The low oxygen partial pressures, however, often result in highleakage currents under applied bias (current densities) in bariumtitanate based compositions due to reduction of the dielectric material.In worse case situations, the capacitor may be shorted and dielectricproperties cannot be measured. This may be addressed by a subsequentre-oxidation procedure carried out at lower temperatures in which thedielectric and metal foil is exposed to higher partial pressures ofoxygen but this results in oxidation of the base metal foil.

A barium titanate CSD composition is disclosed in U.S. National patentapplication Ser. No. 10/621,796 (U.S. Patent Publication No.2005-001185; Attorney Docket No. EL-0513), hereby incorporated herein byreference. The composition is particularly suitable for forming highcapacitance density, ceramic films on copper foil. The precursorcomposition comprises the following chemicals: Barium acetate 2.6 gTitanium isopropoxide 2.9 ml Acetylacetone 2.0 ml Acetic acid 10.0 mlMethanol 15 ml

After annealing at 900° C. in a partial pressure of oxygen ofapproximately 10⁻¹¹ atmospheres, a platinum electrode was sputtered onto the dielectric. However, while capacitance of the film could bemeasured, the dissipation factor was very high under bias and the filmwas semi-conducting and exhibited a very high leakage current densityunder bias. Under such reducing conditions of the annealing process, thebarium titanate dielectric was reduced according to the followingequation:BaTiO₃ +xH₂→BaTiO_(3-x) +xH₂O

A re-oxidation procedure was therefore, necessary to produce parts thathad good electrical data. This procedure can oxidize the foil and doesnot necessarily produce optimum capacitor performance, particularly withrespect to leakage current density under bias. It is also not costeffective to re-oxidize the dielectric in a separate step. It would bean advantage, therefore, if the barium titanate composition could bedoped to produce good electrical performance, particularly a low leakagecurrent density under bias, immediately after the low oxygen partialpressure annealing process.

SUMMARY

Described herein are dielectric thin film compositions comprising: (1)one or more barium/titanium-containing additives selected from (a)barium titanate, (b) any composition that can form barium titanateduring firing, and (c) mixtures thereof; dissolved in (2) organicmedium;

wherein the barium/titanium-containing additives are not intentionallymodified or doped with any specific materials;

wherein the composition has been annealed in an environment having anoxygen partial pressure of less than about 10⁻⁷ atmospheres and/or at atemperature in the range of 700° C. and 1050° C.;

wherein a capacitor comprising the composition would have a loss tangentof greater than about 0.07; and

wherein the composition is not reoxygenated.

Also described herein are methods of making a capacitor comprising:

providing a metallic foil;

forming a dielectric layer made from the compositions described hereinover the metallic foil,

annealing the dielectric layer; and

forming a conductive layer over the dielectric,

whereby the metallic foil, the dielectric, and the conductive layer formthe capacitor.

Also described herein are methods of using a capacitor comprising thesedielectric compositions.

BRIEF DESCRIPTION OF THE DRAWINGS

According to common practice, the various features of the drawingsdiscussed below are not necessarily drawn to scale. Dimensions ofvarious features and elements in the drawings may be expanded or reducedto more clearly illustrate the embodiments of the invention. Thedetailed description will refer to the following drawings, wherein likenumerals refer to like elements, and wherein:

FIG. 1 is a block diagram illustrating a process for preparing aprecursor solution used to form a dielectric that does not require are-oxidation process.

FIG. 2 is a block diagram illustrating a process for making a capacitoron copper foil.

FIG. 3 is a graph showing capacitance density and loss tangent as afunction of voltage for undoped barium titanate without re-oxidation.

FIG. 4 is a graph showing capacitance density and loss tangent as afunction of voltage for undoped barium titanate after re-oxidation.

FIG. 5 is a graph showing leakage current density as a function ofvoltage for undoped pure barium titanate after re-oxidation.

FIG. 6 is a graph showing capacitance density and loss tangent as afunction of voltage for gallium doped barium titanate withoutre-oxidation.

FIG. 7 is a graph showing leakage current density as a function ofvoltage for gallium doped barium titanate without re-oxidation.

FIG. 8 is a graph showing capacitance density and loss tangent as afunction of voltage for cobalt doped barium titanate withoutre-oxidation.

FIG. 9 is a graph showing leakage current density as a function ofvoltage for cobalt doped barium titanate without re-oxidation.

FIG. 10 is a graph showing capacitance density and loss tangent as afunction of voltage for nickel doped barium titanate withoutre-oxidation.

FIG. 11 is a graph showing leakage current density as a function ofvoltage for nickel doped barium titanate without re-oxidation.

FIG. 12 is a graph showing capacitance density and loss tangent as afunction of voltage for magnesium doped barium titanate withoutre-oxidation.

FIG. 13 is a graph showing leakage current density as a function ofvoltage for magnesium doped barium titanate without re-oxidation.

FIG. 14 is a graph showing capacitance density and loss tangent as afunction of voltage for iron doped barium titanate without re-oxidation.

FIG. 15 is a graph showing leakage current density as a function ofvoltage for iron doped barium titanate without re-oxidation.

FIG. 16 is a graph showing capacitance density and loss tangent as afunction of voltage for yttrium doped barium titanate withoutre-oxidation.

FIG. 17 is a graph showing leakage current density as a function ofvoltage for yttrium doped barium titanate without re-oxidation.

FIG. 18 is a graph showing capacitance density and loss tangent as afunction of voltage for aluminum doped barium titanate withoutre-oxidation.

FIG. 19 is a graph showing capacitance density and loss tangent as afunction of voltage for zinc doped barium titanate without re-oxidation.

FIG. 20 is a graph showing capacitance density and loss tangent as afunction of voltage for calcium doped barium titanate withoutre-oxidation.

FIG. 21 is a graph showing capacitance density and loss tangent as afunction of voltage for ytterbium doped barium titanate withoutre-oxidation.

FIG. 22 is a graph showing capacitance density and loss tangent as afunction of voltage for cobalt doped barium strontium titanate(Ba:Sr:Ti=0.6:0.4:1) without oxidation.

FIG. 23 is a graph showing leakage current density as a function ofvoltage for cobalt doped barium strontium titanate (Ba:Sr:Ti=0.6:0.4:1)without re-oxidation.

DETAILED DESCRIPTION

Described herein are high capacitance density thin film barium titanatebased dielectrics that are either acceptor doped or are notintentionally modified or doped with any specific materials and that arenot reoxygenated. Also described are methods of making capacitorscomprising these dielectrics and of using these capacitors.

According to one embodiment, high capacitance density, thin film CSDacceptor doped barium titanate based dielectric compositions aredisclosed. The compositions eliminate the requirement of a re-oxidationprocedure after annealing the dielectric layer at a temperature ofapproximately 900° C., under a low partial pressure of oxygen ofapproximately 10⁻¹¹ atmospheres. According to another embodiment, highcapacitance density, thin film barium titanate based dielectriccompositions that have not been intentionally modified or doped with anyspecific materials are disclosed.

Capacitors constructed according to the methods described herein can beembedded into inner-layer panels, which may in turn be incorporated intoprinted wiring boards. The capacitors have high capacitance densities,low loss tangents, and low leakage current densities under bias.Further, the methods described herein may be practiced without the useof a re-oxidation treatment while using environmentally desirablematerials.

The acceptor doped barium titanate based dielectrics according to thepresent invention may exhibit essentially a similar capacitance densityand equal to or improved loss tangent to those dielectrics using undopedbarium titanate after a re-oxidation procedure. The acceptor dopedbarium titanate based dielectrics when processed without a re-oxidationprocedure, however, have much lower leakage current densities under biasthan re-oxidized pure barium titanate.

Acceptor doping on the titanium site (B site) of crystalline bariumtitanates based dielectrics is used to form high permittivity dielectricfilms or layers in the capacitor embodiments discussed in thisspecification. Acceptor doping on the titanium site can be achieved byusing elements that have a lower valence state than titanium but haveionic radii that is similar enough to titanium for them to dissolve onthe titanium site under the right conditions. In particular, dopantssuch as Sc, Cr, Fe, Co, Ni, Mg, Ca, Zn, Al, Ga, Y and some lanthamidemetals such as Nd, Sm, Eu, Gd, Dy, Ho, Er, Yb, Lu, and mixtures of thesedopants and metals can occupy the B site of the (ABO₃) perovskitestructure. Acceptor dopants trap conduction electrons so that a decreasein insulation resistance and increase in dielectric losses aresuppressed. Acceptor doping with as little 0.002 atom percent may beused to create high dielectric constant thin film dielectrics thatexhibit low dielectric losses and low leakage currents under bias to befabricated under reducing conditions.

BaTiO₃ is a preferred core material in the formation of high capacitancedensity dielectrics according to the present invention. However, metalcations with the oxide stoichiometry of MO₂ may also be used tosubstantially substitute for titanium (e.g., Zr, Hf, Sn and mixturesthereof).

While the terms “partially” and “substantially” are not meant to beparticularly limiting, there are various preferred embodiments. In oneembodiment, “partially” is defined as up to and including 10 molarpercent of the titanium. In one embodiment, “substantially” is definedas up to and including 50 molar percent of the titanium. These broadenthe temperature dependence of capacitance at the Curie point in thedielectric by “pinching” (shifting) the three phase transitions ofBaTiO₃ closer to one another in temperature space. Metal cations havingthe oxide stoichiometry of MO (e.g., Pb, Ca, Sr and mixtures thereof)may also be used to substantially substitute for barium. While the terms“partially” and “substantially” are not meant to be particularlylimiting, there are various preferred embodiments. In one embodiment,“partially” is defined herein as up to and including 10 molar percent ofthe barium. In one embodiment, “substantially” is defined as up to andincluding 50 molar percent of the barium. These cations shift thedielectric Curie point to higher or lower temperatures depending uponthe material used.

The capacitor embodiments discussed herein have a physically robustdielectric thickness in the range of about 0.4-1.0 μm with a capacitancedensity of approximately between 1 and 1.8 μF/cm². Capacitors of thiscapacitance density range have a breakdown voltage in excess of about 20volts.

Chemical solution deposition techniques may be used to form thedielectric. CSD techniques are desirable due to their simplicity and lowcost. The chemical precursor solution from which acceptor doped BaTiO₃based dielectrics are prepared preferably comprise barium acetate,titanium isopropoxide, acetylacetone, acetic acid, diethanolamine, andan acceptor dopant source. The precursor solution may or may not containsubstantial sources of other substitutions for barium or titanium aspreviously discussed. Some examples of acceptor dopant precursors aregiven in Table I. TABLE I Metal Dopant chemicals and amount Solvent(s)amount Ga Gallium acetylacetatonate, 0.43 g Acetic acid, 29.57 g AlAluminum acetylacetonate, 0.38 g Acetic acid, 29.62 g Zn Zinc acetatedihydrate, 0.31 g Acetic acid, 28.16 g Distilled water, 2 g Ca Calciumacetate monohydrate, Acetic acid, 0.22 g 27.78 g Distilled water, 2 g Feα-Hydroxyethylferrocene, 0.26 g Acetic acid, 29.74 g Co Cobalt (II)acetate tetrahydrate, Acetic acid, 0.29 g 29.71 g Ni Nickel acetatetetrahydrate, 0.21 g Acetic acid, 29.79 g Mg Magnesium acetatetetrahydrate, Acetic acid, 0.25 g 29.75 g Y Yttrium acetate hydrate,0.32 g Acetic acid, 29.68 g Yb Ytterbium acetylacetonate hydrate, Aceticacid, 0.55 g 29.45 g

FIG. 1 is a block diagram illustrating a process for preparing aprecursor solution that will be used to form a dielectric according tothe present invention. In step S110, titanium isopropoxide is premixedwith acetyl acetone and heated. The premix can be done in, for example,a PYREX® container, and heating may take place on a hot plate with asurface temperature of about 90° C. In step S120, diethanolamine isadded to the Ti isopropoxide/acetylacetone mixture. In step S130, asolution of barium acetate in acetic acid is added into the container,and stirred. In step S140, a dopant solution chosen from those listed inTable I is added in an amount to give a dopant concentration of0.017-0.018 atom percent and the mixed solution is stirred. In stepS150, acetic acid is added to the solution to yield a 0.2-0.3 molarconcentration. The precursor solution is now suitable for deposition.

FIG. 2 is a block diagram of a method suitable for forming a capacitoraccording to the present invention. The dielectric of the resultantcapacitor may be formed using the precursor solution discussed abovewith reference to FIG. 1. Variants of the acetylacetone components andthe acetic acid used for dilution in the above-described precursorsolution may also be used. For example, acetic acid may be substitutedwith methanol. Acetylacetone may be substituted by an alkoxyalcohol suchas 2-methoxyethanol, 2-ethoxyethanol and 1-methoxy-2-propanol, orethanolamines such as triethanolamine, diethanolamine andmonoethanolamine. Acetic acid may also be substituted by methanol,ethanol, isopropanol, butanol and other alcohols, for example. Titaniumisopropoxide may also be substituted by titanium butoxide.

The deposition process illustrated in FIG. 2 is spin coating. Othercoating methods, such as dip or spray coating, are also feasible. Instep S210, a metallic foil may be cleaned. Cleaning is not alwaysnecessary but may be advisable. The metallic foil may be made fromcopper or other suitable metal. Copper foils are desirable due their lowcost and ease of handling. The copper foil will serve as a substrate onwhich a capacitor is built. The copper foil also acts as a capacitor“bottom” electrode in the finished capacitor. In one embodiment, thesubstrate is an 18 μm thick electroless, bare copper foil. Otheruntreated foils, such as 1 oz copper foil, are also suitable. Suitablecleaning conditions include etching the foil for 30 seconds in a dilutesolution of copper chloride in hydrochloric acid. The etching solutionmay be diluted approximately 10,000 times from its concentrated form.The cleaning process removes the excess oxide layer, fingerprints andother accumulated foreign matter from the foil. If the copper foil isreceived from a vendor or other source in a substantially cleancondition, and is handled carefully and promptly used, the recommendedcleaning process may not be necessary.

The copper foil is preferably not treated with organic additives.Organic additives are sometimes applied in order to enhance adhesion ofa metallic substrate to epoxy resins. Organic additives, however, maydegrade the dielectric film during annealing.

In step S220, the precursor solution discussed above with reference toFIG. 1 is deposited over the drum side (or “smooth side”) of the copperfoil substrate. The precursor solution may be applied using, forexample, a plastic syringe.

In step S230, the substrate is rotated for spin coating. A suitablerotation time and speed are 30 seconds at 3000 revolutions per minute.In step S240, the substrate is heat-treated. Heat treatment may beperformed, for example, at a temperature of 250° C. for five to tenminutes. Heat treatment is used to dry the precursor solution byevaporating solvents in the precursor solution. Consecutive spinningsteps may be used to coat the foil substrate to the desired thickness.Six spinning steps, for example, may be used to produce a final drieddielectric precursor thickness over 0.5 μm.

In step S250, the coated substrate is annealed. Annealing first removesresidual organic material, and then sinters, densifies and crystallizesthe dried dielectric precursor. Annealing may be conducted in a hightemperature, low oxygen partial pressure environment. A suitable totalpressure environment is about 1 atmosphere. A suitable oxygen partialpressure is about 10⁻¹⁰ to 10⁻¹¹ atmospheres.

In step S250, the low oxygen partial pressure may be achieved bybubbling high purity nitrogen through a controlled temperature waterbath. Other gas combinations are also possible. In one embodiment, thefurnace temperature is at least about 900° C., and the oxygen partialpressure is approximately 10⁻¹¹ atmospheres. The water bath may be at atemperature of about 25° C. The annealing can be performed by insertingthe coated foil substrate into a furnace at temperatures below 250° C.The furnace is then ramped up to 900° C. at a rate of about 30°C./minute. The furnace is maintained at 900° C. for approximately 30minutes.

In step S260, the foil substrate is allowed to cool. Cooling may begoverned by a Newtonian profile, for example, created by simplyswitching the furnace off. Alternatively, the furnace temperature may beramped down at a specific rate. When the furnace temperature reachesabout 450° C., the foil substrate may be safely removed from the furnacewithout risk of undesired oxidation effects on the copper foil.Alternatively, the furnace may be allowed to return to room temperaturebefore the foil substrate is removed from the furnace.

In the low oxygen partial pressure annealing process, the copper foil isnot oxidized to Cu₂O or CuO. This resistance to oxidation is due to thelow oxygen pressure and high processing temperature. The dielectric isalso not reduced and maintains its good electrical characteristics,particularly a low leakage current density under bias. This resistanceto reduction is due to the acceptor doping. With acceptor doping,conduction electrons are trapped by the acceptor dopant so that adecrease in insulation resistance and increase in dielectric losses aresuppressed.

The high temperature annealing of 900° C. described above fordensification and crystallization of the deposited dielectric providesdesirable physical properties and desirable electrical properties. Onedesirable physical property is a dense microstructure. Another desirablephysical property is resultant grain sizes between 0.5 μm and 0.2 μm.One desirable electrical property resulting from the grain size is acapacitance density in excess of 1 μF/cm². An additional desirableproperty is a low loss tangent, which in one embodiment may be less than5 percent. In another embodiment, the loss tangent may be less than 2.5percent.

In step 270, top electrodes are formed over the resulting dielectric.The top electrode can be formed by, for example, sputtering,evaporation, chemical vapor deposition, electroless plating, printing orother suitable deposition methods. In one embodiment, sputtered platinumelectrodes are used. Other suitable materials for the top electrodeinclude nickel, copper, gold and palladium. The top electrodes may beplated with copper to increase thickness, if desired.

The following examples illustrates the favorable properties indielectrics prepared according to the present invention, and thecapacitors incorporating the dielectrics.

EXAMPLE 1

An intentionally undoped pure barium titanate thin film was prepared ona copper foil using the formula listed below and prepared as outlined inFIG. 1. The copper foil was coated with the dielectric precursorcomposition using the method outlined in FIG. 2. Barium acetate  2.0 gTitanium isopropoxide 2.22 g Acetylacetone 1.56 g Acetic acid 17.0 gDiethanolamine 0.21 g

The formula was then spin-coated on Cu foil. After each coat the filmwere pre-baked at temperatures at 250° C. on a hot plate in air. Thecoating/pre-baking process was repeated six times. The coated copperfoil was annealed at 900° C. for 30 minutes under a partial pressure ofoxygen of approximately 10⁻¹¹ atmospheres. After annealing the purebarium titanate, a platinum top electrode was sputtered on to thedielectric and the capacitance, m and leakage current density under biaswas measured. The capacitance density was approximately 1.5 μF/cm² at 0volt but the loss tangent increased dramatically in the voltage sweep asshown in FIG. 3.

EXAMPLE 2

An undoped pure barium titanate thin film was prepared on a copper foilusing the formula listed below and prepared as outlined in FIG. 1. Thecopper foil was coated with the dielectric precursor composition usingthe method outlined in FIG. 2. Barium acetate  2.0 g Titaniumisopropoxide 2.22 g Acetylacetone 1.56 g Acetic acid 17.0 gDiethanolamine 0.21 g

The formula was then spin-coated on Cu foil. After each coat the filmwere pre-baked at temperatures at 250° C. on a hot plate in air. Thecoating/pre-baking process was repeated six times. The coated copperfoil was annealed at 900° C. for 30 minutes under a partial pressure ofoxygen of approximately 10⁻¹¹ atmospheres. The dielectric was thenre-oxidized by placing the foil in a vacuum chamber under an atmosphereof approximately 10⁻⁵ Torr of oxygen at 550° C. for 30 minutes. Thiscondition was chosen to avoid significant oxidation of the copper foilwhile still providing oxygen for re-oxidation of the dielectric. Afterre-oxidation, a top platinum electrode was sputtered on to thedielectric and the capacitance, dissipation factor and leakage currentdensity under bias could be measured.

The capacitance density was again approximately 1.5 μF/cm² at 0 volt butin this case, the loss tangent remained low as shown in FIG. 4. The purere-oxidized barium titanate layer exhibited low leakage currents underzero bias but high leakage current densities of the order of 1 amp/cm²under 10 volts bias as shown in FIG. 5.

EXAMPLE 3

A gallium doped barium titanate thin film was prepared on a copper foilin the similar manner described in EXAMPLE 1 using the precursorsolution described below. The gallium dopant solution comprised thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gGallium dopant solution 0.18 g

The capacitance density and loss tangent for a gallium doped bariumtitanate layer without re-oxidation are shown in FIG. 6. The capacitancedensity was approximately 1.5 μF/cm² at 0 volt and the loss tangent wasless than or equal to 0.05 and the dissipation factor did not degradeunder bias. As shown in FIG. 7, the gallium doped barium titanatewithout an oxidation procedure showed a low leakage current density ofapproximately 10 micro-amps/cm² at 10 volts bias or approximately100,000 times lower leakage current flow versus the re-oxidized undopedbarium titanate.

EXAMPLE 4

A cobalt doped barium titanate thin film was prepared on a copper foilin the similar manner described in EXAMPLE 1 using the precursorsolution described below. The cobalt dopant solution comprised thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gCobalt dopant solution 0.18 g

The capacitance density and loss tangent for a cobalt doped bariumtitanate layer without re-oxidation are shown in FIG. 8. The capacitancedensity was approximately 1.7 μF/cm² at 0 volt and the loss tangent wasless than 0.07 percent and the dissipation factor did not degrade underbias. As shown in FIG. 9, the cobalt doped barium titanate without are-oxidation procedure showed a low leakage current density ofapproximately 1 micro-amps/cm² at 10 volts bias or approximately1,000,000 times lower leakage current flow versus the re-oxidizedundoped barium titanate.

EXAMPLE 5

A nickel doped barium titanate thin film was prepared on a copper foilin the similar manner described in EXAMPLE 1 using the precursorsolution described below. The nickel dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gNickel dopant solution 0.18 g

The capacitance density and loss tangent for a nickel doped bariumtitanate layer without re-oxidation are shown in FIG. 10. Thecapacitance density was approximately 1.7 μF/cm² at 0 volt and the losstangent was less than or equal to 0.05 and the dissipation factor didnot degrade under bias. As shown in FIG. 11, the nickel doped bariumtitanate without a re-oxidation procedure showed a low leakage currentdensity of approximately 1000 micro-amps/cm² at 10 volts bias orapproximately 1,000 times lower leakage current flow versus there-oxidized undoped barium titanate.

EXAMPLE 6

A magnesium doped barium titanate thin film was prepared on a copperfoil in the similar manner described in EXAMPLE 1 using the precursorsolution described below. The magnesium dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gMagnesium dopant solution 0.17 g

The capacitance density and loss tangent for a magnesium doped bariumtitanate layer without re-oxidation are shown in FIG. 12. Thecapacitance density was approximately 1.6 μF/cm² at 0 volt and the losstangent was less than 0.07 and the dissipation factor did not degradeunder bias. As shown in FIG. 13, the magnesium doped barium titanatewithout a re-oxidation procedure showed a low leakage current density ofapproximately 1 micro-amps/cm² at 10 volts bias or approximately1,000,000 times lower leakage current flow versus the re-oxidizedundoped barium titanate.

EXAMPLE 7

An iron doped barium titanate thin film was prepared on a copper foil inthe similar manner described in EXAMPLE 1 using the precursor solutiondescribed below. The iron dopant solution comprises the chemicals listedin Table I: Barium acetate  2.0 g Titanium isopropoxide 2.22 gAcetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 g Irondopant solution 0.17 g

The capacitance density and loss tangent for an iron doped bariumtitanate layer without re-oxidation are shown in FIG. 14. Thecapacitance density was approximately 1.8 μF/cm² at 0 volt and the losstangent was less than 0.06 and the dissipation factor did not degradeunder bias. As shown in FIG. 15, the iron doped barium titanate withouta re-oxidation procedure showed a low leakage current density ofapproximately 1 micro-amps/cm² at 10 volts bias or approximately1,000,000 times lower leakage current flow versus the re-oxidizedundoped barium titanate.

EXAMPLE 8

An yttrium doped barium titanate thin film was prepared on a copper foilin the similar manner described in EXAMPLE 1 using the precursorsolution described below. The yttrium dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gYttrium dopant solution 0.19 g

The capacitance density and loss tangent for an yttrium doped bariumtitanate layer without re-oxidation are shown in FIG. 16. Thecapacitance density was approximately 1.5 μF/cm² at 0 volt and the losstangent was less than or equal to 0.06 and the dissipation factor didnot degrade under bias. As shown in FIG. 17, the yttrium doped bariumtitanate without a re-oxidation showed a low leakage current density ofapproximately 1 micro-amps/cm² at 10 volts bias or approximately1,000,000 times lower leakage current flow versus the re-oxidizedundoped barium titanate.

EXAMPLE 9

An aluminum doped barium titanate thin film was prepared on a copperfoil in the similar manner described in EXAMPLE 1 using the precursorsolution described below. The aluminum dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gAluminum dopant solution 0.18 g

The capacitance density and loss tangent for a aluminum doped bariumtitanate layer without re-oxidation are shown in FIG. 18. Thecapacitance density was approximately 1.1 μF/cm² at 0 volt and the losstangent was less than 0.05 and the dissipation factor did not degradeunder bias.

EXAMPLE 10

A zinc doped barium titanate thin film was prepared on a copper foil inthe similar manner described in EXAMPLE 1 using the precursor solutiondescribed below. The zinc dopant solution comprises the chemicals listedin Table I: Barium acetate  2.0 g Titanium isopropoxide 2.22 gAcetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 g Zincdopant solution 0.18 g

The capacitance density and loss tangent for a zinc doped bariumtitanate layer without re-oxidation are shown in FIG. 19. Thecapacitance density was approximately 1.7 μF/cm² at 0 volt and the losstangent was less than 0.05 and the dissipation factor did not degradeunder bias.

EXAMPLE 11

A calcium doped barium titanate thin film was prepared on a copper foilin the similar manner described in EXAMPLE 1 using the precursorsolution described below. The calcium dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gCalcium dopant solution 0.17 g

The capacitance density and loss tangent for a calcium doped bariumtitanate layer without re-oxidation are shown in FIG. 20. Thecapacitance density was approximately 1.7 μF/cm² at 0 volt and the losstangent was less than 0.05 and the dissipation factor did not degradeunder bias.

EXAMPLE 12

An ytterbium doped barium titanate thin film was prepared on a copperfoil in the similar manner described in EXAMPLE 1 using the precursorsolution described below. The ytterbium dopant solution comprises thechemicals listed in Table I: Barium acetate  2.0 g Titanium isopropoxide2.22 g Acetylacetone 1.56 g Acetic acid 17.0 g Diethanolamine 0.21 gYtterbium dopant solution 0.17 g

The capacitance density and loss tangent for an ytterbium doped bariumtitanate layer without re-oxidation are shown in FIG. 21. Thecapacitance density was approximately 1.7 μF/cm² at 0 volt and the losstangent was less than or equal to 0.06 and the dissipation factor didnot degrade under bias.

EXAMPLE 13

A cobalt doped barium strontium titanate (Ba:Sr:Ti=0.6:0.4:1) thin filmwas prepared on a copper foil in the similar manner described in EXAMPLE1 except that barium acetate was partially replaced by strontium acetateto give a molar ratio of 60/40. Additionally, the cobalt dopant levelwas ca. 0.01 atom percent versus ca. 0.02 atom percent dopant level forexamples 1 through 12. The precursor solution is shown below. The cobaltdopant solution comprises the chemicals listed in Table I: Bariumacetate  3.0 g Strontium acetate hydrate 1.61 g Titanium isopropoxide5.56 g Acetylacetone 3.92 g Acetic acid 40.85 g  Diethanolamine 0.32 gCobalt dopant solution 0.27 g

The capacitance density and loss tangent for a cobalt doped bariumstrontium titanate layer without re-oxidation are shown in FIG. 22. Thecapacitance density was approximately 1.3 μF/cm² at 0 volt and the losstangent was less than or equal to 0.025 and the dissipation factor didnot degrade under bias. As shown in FIG. 23, the cobalt doped bariumstrontium titanate without a re-oxidation procedure showed a low leakagecurrent density of approximately 1 micro-amps/cm² at 10 volts bias orapproximately 1,000,000 times lower leakage current flow versus there-oxidized undoped barium titanate.

1. A dielectric thin film composition comprising: (1) one or morebarium/titanium-containing additives selected from the group consistingof (a) barium titanate, (b) any composition that can form bariumtitanate during firing, and (c) mixtures thereof; dissolved in (2)organic medium; wherein the barium/titanium-containing additives are notmodified or intentionally doped; wherein the composition has beenannealed in an environment having an oxygen partial pressure of lessthan about 10⁻⁷ atmospheres and/or at a temperature in the range of 700°C. and 1050° C.; wherein a capacitor comprising the composition wouldhave a loss tangent of greater than about 0.07; and wherein thecomposition is not reoxygenated.
 2. The composition of claim 1 whereinthe barium in said barium/titanium-containing additive has beenpartially or substantially replaced by one or more metal cations havingthe oxide stoichiometry of MO wherein M is selected from the groupconsisting of (a) strontium; (b) lead; (c) calcium; and (d) mixturesthereof.
 3. The composition of claim 1 wherein the titanium in saidbarium/titanium-containing additive has been partially or substantiallyreplaced by one or more metal cations having the oxide stoichiometry ofMO₂ wherein M is selected from the group consisting of (a) zirconium;(b) hafnium; (c) tin; and (d) mixtures thereof.
 4. A capacitorcomprising the thin film composition of claim 1 and having a losstangent greater than about 0.07.
 5. An innerlayer panel comprising thecapacitor of claim
 4. 6. A printed wiring board comprising the capacitorof claim
 4. 7. A method of making a capacitor comprising: providing ametallic foil; forming a dielectric over the metallic foil, whereinforming the dielectric comprises: forming a dielectric layer over thefoil wherein the dielectric layer is formed from the composition ofclaim 1; annealing the dielectric layer; and forming a conductive layerover the dielectric, whereby the metallic foil, the dielectric, and theconductive layer form the capacitor.
 8. The method of claim 7, whereinannealing comprises annealing at a temperature in the range of about700° C. to 1050° C.
 9. The method of claim 7, wherein annealingcomprises annealing in an environment having an oxygen partial pressureof less than about 10⁻⁷ atmospheres.
 10. The method of claim 7, whereinannealing results in a dielectric comprising crystalline barium titanateor crystalline barium strontium titanate.
 11. The method of claim 7,wherein the capacitor has a capacitance density of at least 1.5 μF/cm².12. A method of using a capacitor comprising the composition of claim 1,comprising: embedding the capacitor into a printed wiring board.
 13. Themethod of claim 12, wherein the embedded capacitor is used to dampenfluctuations of voltage around a desired value.